Sébastien Raoux, Carbon Trading and the Semiconductor Industry, Semiconductor International (2009)
This paper reviews how the semiconductor industry can further reduce greenhouse gas emissions by embracing carbon trading mechanisms.

Analía Marsella, The Responsibilities of States for Actions of Transnational Corporations Affecting Social and Economic Rights: A Comparative Analysis of the Duty to Protect, 15 Colum. J. Eur. L. Online 33 (2009)
This article addresses the protective function of States and their international responsibility for actions of non-state actors, as an indirect way to promote compliance with social and economic rights standards by transnational corporations, including those concerning environmental issues.

Analía Marsella, Transnational Corporations (TNCs) and the Effective Implementation of Social and Economic Rights: Current and Prospective Avenues, The Selected Works of Analia Marsella Sende (2008)
This essay explains the role and impact of transnational corporations in the process of development and implementation of economic and social rights at a global scale and identifies solutions regarded as plausible.

Sébastien Raoux, Meeting the Climate Challenge: Applying Moore’s Law to Reduce Greenhouse Gas Emissions From the Electronics Industry, Fab Engineering & Operations Magazine (FEO), Issue 1 (2007)
This paper addresses solutions and the upcoming regulatory and business trends related to PFC emissions reduction from the electronics industry.

Sébastien Raoux, Reducing your Carbon Footprint…? Think Fluorine First (2007) (originally published by Chemical Management Systems forum on (on file with author).
This article provides an overview of the use of fluorinated compounds contributing to climate change and examines ways to reduce their emissions.

Sébastien Raoux, Implementing Technologies for Reducing PFC Emissions, Solid State Technologies (2006)
This article reviews the various solutions that can be used to reduce PFC emissions and examine their economical implications.

Sébastien Raoux, Strategies for Cost Effective Implementation of PFC Emissions Reduction Solutions in the Semiconductor Industry, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment 251-252,  IEEE Computer Society (2006)
This article provides an overview of the strategy to reduce emissions in a semiconductor fabrication plant at the lowest possible cost.

Nikil Krishnan et al., Using a Hybrid Approach to Evaluate Semiconductor Life Cycle Environmental Issues - A Case Study in Interconnect Module Impacts, Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment 86-89, IEEE Computer Society (2004)
In this article, a methodology to perform a hybrid approach to evaluate semiconductor life cycle impacts is developed. The approach attempts to overcome several semiconductor LCA (life cycle assessment) challenges and is illustrated through a case study in life cycle environmental impacts of an interconnect module in a logic device.

Nikil Krishnan et al., Alternatives to Reduce Perfluorinated Compound (PFC) Emissions from Semiconductor Dielectric Etch Processes: Meeting Environmental Commitments while Minimizing Costs, Proceedings of the 2003 IEEE International Symposium on Electronics and the Environment 19-24, IEEE Computer Society (2003)
This articles focuses on PFC emissions from etch processes and uses design for environment (DfE) analysis to compare processes and options.

Peter I. Porshnev et al., PFC Abatement in Capacitevely-Coupled Plasma Reactor, American Physical Society, 54th Annual Gaseous Electronics Conference October 9-12, 2001 Pennsylvania State University State College, Pennsylvania Meeting (2001)
This article reviews the development of a low-pressure plasma source designed to abate PFC emissions from dielectric etch systems.

Sébastien Raoux et al., Remote Microwave Plasma Source for Cleaning Chemical Vapor Deposition Chambers: Technology for Reducing Global Warming Gas Emissions,  J. Vac. Sci. Technol. B 17, 477 (1999)
This article describes the revolutionary remote clean technology which led to a two orders of magnitude reduction in greenhouse gas emissions from CVD chamber cleaning processes.

Sébastien Raoux & J. Langan, Remote NF3 Chamber Clean Virtually Eliminates PFC Emissions from CVD Chambers and Improves System Productivity, Semiconductor Fabtech -, White Papers, Edition 09, EHS (Mark Osborne ed., 1999)
This article provides an overview of the NF3 chamber cleaning technology which allows to reduce emissions from CVD chamber cleaning.

Sébastien Raoux et al., Growth, Trapping and Abatement of Dielectric Particles in PECVD Systems, Plasma Sources Sci. Technol. 6, 405 (1997)
This article presents a solution to reduce solid waste and greenhouse gas emissions from chemical vapor deposition processes.